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Precision metering, mixing, controlling, and dispensing for all applications.

Kirkco

NDA Protected Application

Epoxy Potting for LED Drivers and Power Electronics

Executive Overview

Kirkco engineered an epoxy potting architecture for LED drivers and power electronics where thermal management, moisture resistance, and electrical insulation are critical to long-term field performance. The architecture applies a controlled encapsulation approach to stabilize quality across high-volume production.

Business & Quality Drivers

LED system manufacturers face warranty exposure driven by heat, humidity, and electrical stress. Manual potting methods resulted in inconsistent fill levels and trapped air, increasing early-life failures. A production-grade encapsulation architecture was required to improve reliability while maintaining throughput.

Process Requirements

The application required two-component epoxy potting with precise ratio control, temperature-conditioned material delivery, and defined shot volumes to ensure void-free fills across varying housing geometries.

System Architecture

The potting platform utilizes precision metering and mixing with point-of-application dispensing to minimize residence time. Temperature control across the material path maintains viscosity stability and repeatable flow behavior.

Controls & Validation

PLC-based controls manage recipes, ratio monitoring, automated flushing, and interlocks. Process windows were validated to ensure consistent potting quality across production lots.

Encapsulation Quality Framework Alignment

This application is governed by Kirkco’s encapsulation quality framework, which standardizes ratio stability, thermal control, void mitigation, and validation practices across encapsulation systems. Reference: Encapsulating Quality – Application Architecture (Rev C).

Operational Performance

Implementation reduced scrap, improved thermal consistency, and stabilized electrical performance while supporting predictable cycle times.

Lifecycle & Scalability

The architecture supports future material changes, additional power ratings, and throughput increases without structural redesign.

Adhesives & SealantsTwo-Component Adhesive Metering & Mixing Systems