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Precision metering, mixing, controlling, and dispensing for all applications.

Kirkco

NDA Protected Application

Epoxy Encapsulation for Industrial Electronics and Controls

Executive Overview

Kirkco engineered an epoxy encapsulation architecture for industrial electronic and control assemblies requiring stable electrical performance, environmental protection, and long-term reliability in demanding operating conditions. The architecture applies proven encapsulation quality principles to ensure consistent results across production programs.

Business & Quality Drivers

Industrial control manufacturers face reliability expectations driven by uptime requirements and warranty exposure. Variability in manual potting processes introduced risks related to voiding, inconsistent cure, and thermal stress. A controlled encapsulation architecture was required to stabilize quality and reduce lifecycle risk.

Process Requirements

The application required two-component epoxy encapsulation with controlled ratio management, stable material temperature, defined shot volumes, and repeatable fill behavior across multiple enclosure geometries.

System Architecture

The encapsulation platform utilizes precision metering and mixing equipment with temperature-conditioned material handling. Point-of-application mixing minimizes residence time and supports void-free encapsulation across varying part sizes.

Controls & Validation

PLC-based controls manage recipe storage, ratio monitoring, automated flushing, and process interlocks. Defined process windows were validated to ensure consistent encapsulation quality across production runs.

Encapsulation Quality Framework Alignment

This application is executed within Kirkco’s encapsulation quality framework, which standardizes ratio stability, thermal control, void mitigation, and process validation across encapsulation systems. For a system-level view of how encapsulation quality is engineered across applications, reference: Encapsulating Quality – Application Architecture (Rev C).

Operational Performance

The architecture reduced rework, stabilized encapsulation quality, and minimized operator dependency while supporting predictable production throughput.

Lifecycle & Scalability

Designed for long-term service, the system supports future material changes, additional recipes, and throughput increases without architectural redesign.

Adhesives & SealantsTwo-Component Adhesive Metering & Mixing Systems